zentrum mikroelektronik dresden ag editor: signed schoder date: 30.04.2002 doc-no. qs-000758-hd-02 check signed marx quality signed gersdorf: zmd-standard april 2002 supersedes edition 12.99 package LQFP44 (10 x 10 ) mds 758 dimensions in millimetres based on jedec jep95: ms-026 1dimensions dimensions of sub-group b1 dimensions of sub-group c1 e nom 0,80 a min - a max 1,60 a 1min 0,05 b pmin 0,30 a 1max 0,15 b pmax 0,45 a 2min 1,35 h emin 11,85 a 2max 1,45 h emax 12,15 c min 0,09 h dmin 11,85 c max 0,20 h dmax 12,15 d min *9,75 l pmin 0,45 d max * 10,25 2weight 0,5 g e min *9,75 3 package body material low stress epoxy e max * 10,25 4lead material feni-alloy or cu-alloy min 0 5lead finish solder plating max 7 6lead form z-bends * without mold-flas a 1 l p c detail z d a 2 a 0,1 h e h d b p e 1 e m 0,2 z 44 free datasheet http://
zentrum mikroelektronik dresden ag editor: signed schoder date: 30.04.2002 doc-no. qs-000758-hd-02 check signed marx quality signed gersdorf: zmd-standard april 2002 supersedes edition 12.99 package LQFP44 (10 x 10 ) mds 758 dimensions in millimetres based on jedec jep95: ms-026 1dimensions dimensions of sub-group b1 dimensions of sub-group c1 e nom 0,80 a min - a max 1,60 a 1min 0,05 b pmin 0,30 a 1max 0,15 b pmax 0,45 a 2min 1,35 h emin 11,85 a 2max 1,45 h emax 12,15 c min 0,09 h dmin 11,85 c max 0,20 h dmax 12,15 d min *9,75 l pmin 0,45 d max * 10,25 2weight 0,5 g e min *9,75 3 package body material low stress epoxy e max * 10,25 4lead material feni-alloy or cu-alloy min 0 5lead finish solder plating max 7 6lead form z-bends * without mold-flas a 1 l p c detail z d a 2 a 0,1 h e h d b p e 1 e m 0,2 z 44 free datasheet http://
|
